Rigid PCB fabrication

As the traditional rigid printed circuit board industry continues to advance to thinner and thinner boards and in-layer panels, the existing PCB handling equipment can damage or fail to handle thin panels. Northfield Automation provides automated panel handling systems for transfer, load, and load, stacking, and resist laminating. For advanced PCB requirements, we can provide lamination equipment that subjects the entire lamination process to atmospheric conditions down to 10 -6 torr to provide an extremely high degree of encapsulation of irregular surface contours.

 Thin-film Energy Devices
 Electronic component fabrication
 Food processing
 Flexible circuit fabrication
 RFID tag, inlay and antenna  fabrication
 Photo chemical etched  componentry
 Medical devices
 Thin-film display
 Rigid PCB fabrication
 Packaging
 Smart card
 

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